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Materials
Needs for high-reliability materials
in high-tech fields
- Demand for high reliability and excellent materials to improve surface mount technology (SMT) in the high-tech field.
- As a material(solder, bond) that satisfies global manufacturers(automotive, electrical/electronic fields),
it leads and differentiates customer products. - Accelerate R&D and enhancement of quality with material(solder, bond) expert design support.
Material solutions for advanced quality
Application field
Automotive device
Automotive Device
- ADAS devices and safety aids
- ECU(Electronic Control Unit)
- MEMS Sensor
- LED Headlight Module
- Black Box
Industrial
Device
Industrial
Device
- Smart Phone, Tablet PC etc.
- PC(Desktop, Notebook etc.)
- Outdoor IoT
- CCTV, Mentoring Device etc.
Semiconductor
Semiconductor
- Power TR
- BGA
- Module
- Ball attach
- Other
automotive
device
ADAS devices and safety aids
- ECU(Electronic Control Unit)
- MEMS Sensor
- LED Headlight Module
- Black Box
industrial
device
- Smart Phone, Tablet PC etc.
- PC 기기(Desktop, Notebook etc.)
- Outdoor IoT
- CCTV, Mentoring Device etc.
semiconductor
- Power TR
- BGA
- Module
- Ball attach
- Other
Solder paste, Solder ball, Solder preform
Indium is the world's leading U.S. company in the solder field with an 85-year history.
Solder
paste
Flux
solder
Wire
in
froms
heat
spring
ag sinter
paste
solder
bar
solder
ball
solder
preforms
- Meets MS184-01 test criteria
- Air condition & N2 reflow both available
- Halogen-free (per EN 14582)
- Stancil Life (60 hours)
- Excellent void characteristics (Void Free 15% under)
- Low printer pressure
- High yield , High oxidation resistance
SMD Adhesive chip bond, Epoxy Adhesive, UV Adhesive
미성화학㈜은 1994년부터 Epoxy, Polyurethane 등으로
자동차 및 전기, 전자부품시장에서 품질 고급화를 위하여
기술개발에 전력을 다하여 온 회사입니다.
