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4_4. Flux_Slideimage1_4vs3
4_4_2. Fluxes_Sliding2_4vs3

Materials

Fluxes

    Application

  • Ball-attach
  • Flip-chip
  • Package-on-package and fine-pitch component attach
  • TCB and Cu-Pillar
  • Wafer-bumping
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    ※Please refer to the “INDIUM” website above for product types and technology status.

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